SIGMADESIGN has collaborated with a consumer electronics company seeking an experienced Electrical Fault Isolation Engineer to join their facility in Redmond, WA. This position is a contract with an expected duration of 12 months with the opportunity to be extended.
While on contract with SIGMADESIGN, you will be eligible for the following benefits:
- Choice of multiple options for medical and dental insurance including options with a FSA or HSA
- 401(k) with up to 4% company match
- 15-days of accrued PTO and 9 company paid holiday
- Voluntary benefits: vision, long-term disability, and life insurance
- Salary: $120,000-155,000/year DOE
Primary Function:
The Electrical Fault Isolation Engineer is responsible for electromechanical test creation and execution on customer designed hardware.
Essential Job Functions - Responsibilities:
- Develop methods and perform integrated circuit (IC) fault isolation to identify failure locations/modes utilizing Time Domain Reflectometry (TDR), Electro Optical Terahertz Pulse Reflectometry (EOTPR), Lock in Thermography (LIT), IR Thermography, and Photon Emission Microscopy (PEM)
- Conduct research in developing and identifying new fault isolation techniques
- Perform electrical bench testing and interpret ATE data logs to aid in localizing electrical failures
- Develop, characterize, and optimize FA techniques and tools to advance FA capabilities/efficiency
- Write in-detailed easy to follow SOPs for each technique being used
Education and Experience: (Knowledge, skills, & abilities)
- Bachelor’s degree in electrical engineering or related technical field or equivalent experience
- Minimum of 3 years of experience in board design and electrical fault isolation method developments on PCB, FPC, semiconductors, analog, mixed signal IC devices,
- Hands-on experience in electrical fault isolation and defect characterization tools and techniques including but not limited to: TDR, EOTPR, LIT, PEM, curve tracing, and nano/micro-probing
- In-depth understanding of both digital and analog circuits, device physics, IC/PCB fabrication processes
- Great communication skills (verbal and written)
- Excellent teamwork/interpersonal skills and the ability to communicate effectively. Demonstrated ability to work collaboratively, both within and outside one's own work group.
- Demonstrate commitment and adherence to SIGMADESIGN Core Values.
- Pass a post-offer background verification.
Preferred Qualifications:
- Knowledge of integrated electronics fabrication processes and experience with electro-mechanical systems assembly
- Experience with performing physical analysis, including IC de-processing, parallel lapping, cross-sectioning, and package construction analysis to aid in localizing and identifying failure mechanism
- Experience with materials relevant to flexible electronic devices, i.e. photo patternable polymeric resins, elastomers, conductors, underfills, encapsulant materials, thermal materials
Work Environment:
Standard lab/production environment. Appropriate safety garments (PPE) must be worn. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients or suppliers. Must be able to stand and work as long as 12 hours in different positions. Must be able to lift up to 50 pounds unassisted.
SIGMADESIGN is an Equal Opportunity Employer